2F R212 Process Equipment

2F R212

ENG III 2F, 52 ping

Equipped with high-temperature tube furnaces, thermal evaporation, etching, glove boxes, and multiple clean hoods.

2F R212 process equipment

Furnace / THERMO LINDBERG 1700C Tube Furnaces

• Status:Available.
• Function:High-precision high-temperature reaction experiments up to 1,700°C.

Thermal Evaporator

• Status:Available.
• Function:Thermal evaporation of metal films on wafer fragments smaller than 2 inches.
• Wafer carrier size:6-inch.
• Metals:Ti, Al, Ni, Au, Ag, Cr, Si, In, and Pd.
• Pumping system:RP + turbo pump; minimum pressure 2.0E-6 Torr.

Mask Aligner / Suss MJB-3

• Status:Available.
• Function:Photoresist exposure for wafer fragments smaller than 2 inches.
• Mask size:4-inch and 5-inch.
• Process capability:Minimum linewidth: 3 µm; alignment error: 1 µm.

Neutral Beam Etcher / YOUTEC

• Status:Available.
• Function:Generates a neutral particle beam for material etching.
• Wafer size:4-inch wafers; fragments may be attached to a 4-inch wafer.
• Process gases:Cl₂, BCl₃, SF₆, H₂, He, Ar, O₂, and N₂.

Clean Hood / Glove Box / ALE

Clean hoods and glove boxes support pre- and post-process handling and specialized environments. ALE is reserved equipment and remains subject to a future equipment notice.