Layout
1F R108
ENG III 1F, 33.2 ping
The entire area is a yellow-light zone supporting lithography exposure and related front-end processes.
Several new tools are expected to come online during summer 2026.
Maskless Aligner / Heidelberg Instruments MLA150
- Status:Available.
- Function:Exposes wafers directly from a digital mask file without a physical mask.
- Wafer size:6-inch and 8-inch wafers.
- Process capability:Minimum linewidth: 0.65 µm.
- Location:ENG III R108 cleanroom yellow-light area.
Item | NTHU | Academic | Commercial | Notes |
|---|---|---|---|---|
Equipment use fee | NT$1,920/hour | NT$2,880/hour | NT$3,840/hour | Self-operation. |
Staff-supported processing rate | NT$3,000/hour | NT$4,500/hour | NT$6,000/hour | Staff-supported processing. |
Training / qualification | Training: NT$1,500; assessment: NT$1,000 per attempt | Training: NT$1,500; assessment: NT$1,000 per attempt | Training: NT$1,500; assessment: NT$1,000 per attempt | Electrical Engineering users may qualify for the prepaid-deposit discount described in the current notice. |
Booking:The current plan is to use Google Calendar / a form-based calendar system for reservations and billing.
Double-side Mask Aligner / OAI J500
- Status:Operating.
- Function:Performs photoresist exposure using the corresponding mask design and provides a calibrated platform for precise device-to-mask alignment.
- Wafer size:4-inch wafers.
- Process capability:Minimum linewidth: 2 µm.
Item | NTHU | Academic | Commercial | Notes |
|---|---|---|---|---|
Equipment use fee | NT$100/hour | NT$200/hour | NT$500/hour | Self-operation. |
Staff-supported processing fee | NT$300/hour | NT$300/hour | NT$300/hour | Staff-supported processing: equipment use fee + staff-supported processing fee. |
Equipment planned for summer 2026
Equipment | Status | Use |
|---|---|---|
E-Beam | Summer 2026 | Electron-beam process equipment. |
Metallography & Optical Microscope | Summer 2026 | Metallographic and optical microscopy. |
Coater / Clean Hood / Laminator / UV Exposure / Spin Processor / Hot Plate / Developer | Summer 2026 | Supports coating, exposure, development, and related yellow-light processes. |
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