3F R300
Rear-building 3F, 134.3 ping
Equipped with deep reactive-ion etching, ALD, bonding, E-GUN, and 2D MOCVD tools.
3F R300 rear-building equipment
Deep RIE / SPTS LPX Pegasus
- Status:Available.
- Function:Provides high-aspect-ratio etching for single-crystal or polycrystalline silicon.
- Wafer size:4-inch.
- Process gases:SF₆, C₄H₈, and O₂.
- Process capability:Minimum etched trench width: 4 µm.
Item | NTHU | Academic | Commercial | Notes |
|---|---|---|---|---|
Equipment use fee | NT$4,200/hour | NT$6,000/hour | NT$9,000/hour | This tool is not available for self-operation. |
Staff-supported processing fee | NT$3,000/hour | NT$3,000/hour | NT$3,000/hour | Staff-supported processing: equipment use fee + staff-supported processing fee. |
ALD / Picosun R-200 Advanced
- Status:Available.
- Function:Deposits Al₂O₃ films.
- Wafer size:Wafer fragments up to 8 inches.
- Process:Thermal deposition, H₂O process.
Item | NTHU | Academic | Commercial | Notes |
|---|---|---|---|---|
Equipment use fee | NT$2,000/hour | NT$2,500/hour | NT$5,000/hour | This tool is not available for self-operation. |
Staff-supported processing fee | NT$1,000/hour | NT$1,000/hour | NT$1,000/hour | Staff-supported processing: equipment use fee + staff-supported processing fee. |
E-GUN / Cello-Ohmiker 50B
- Status:Available.
- Function:Deposits metal materials on wafers according to user requirements.
- Wafer size:Wafers up to 4 inches; up to nine wafers per run.
- Process:Thermal deposition, H₂O process.
Item | NTHU | Academic | Commercial | Notes |
|---|---|---|---|---|
Equipment use fee | NT$1,000/hour | NT$2,000/hour | NT$5,000/hour | Self-operation. |
Staff-supported processing fee | NT$300/hour | NT$300/hour | NT$300/hour | Staff-supported processing: equipment use fee + staff-supported processing fee. |
Target material | Rate |
|---|---|
Gold (Au) / platinum (Pt) / silver (Ag) | User-provided |
Other metals: Al, Cr, Ni, Ti | NT$0.5 / Å |
Bonder / RIE-400IP / Clean Hood
Supports bonding, etching, and back-end processes. Detailed specifications and rates are subject to the current equipment notice.
2D MOCVD
Planned for summer 2026. The MOCVD Cluster / M3D-ICs will support 2D-material processes; detailed specifications and rates will be published when the tool is commissioned.
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